IMS – Insulated Metal Base PCBs

MPCB – materials: Bergquist/HT-07006 A1:5052; solder mask: Tamura/DSR-2200 TT 31DX; board thickness: 1.85mm +/- 10%; copper thickness: 3oz; surface treatement: LF HASL; description: power products
FeatureTechnical Specification
Number of layers 1 – 4 layers
Technology highlightsEffective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
MaterialsAluminium & copper plates. FR-4, PTFE, thermal dielectrics.
Dielectric thickness0.05mm – 0.20mm
Thermal conductivity3 (W/(m·K))
Profile methodPunching, Liquid cooled routing
Copper weights (finished)35um – 140um
Minimum track and gaps0.10mm / 0.10mm
Metal core thickness0.40mm – 3.20mm
Maximum dimensions 550mm x 700mm
Surface finishes availableHASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver
Minimum mechanical drill0,30mm