8L multilayer – general description: high density PCB; materials: FR-4 Shengyi S-1000-2; solder mask color: blue; surface treatment: ENIG; PTH to copper line spacing: 0.015mm; inner/outer layer line width and spacing: 0.07mm/0.075mm; impedance control tolerance: +/- 7%; hole size tolerance: +/- 0.05mm; BGA pad: 0.25mm
| Feature | Technical Specification |
|---|---|
| Number of layers | 4 – 22 layers standard, 30 layers advanced, 40 layers prototype. |
| Technology highlights | Multilpe layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses. |
| Materials | High performance FR-4, Halogen-free FR-4, Low loss and High frequency materials |
| Copper weights (finished) | 18um – 210um, advanced 1050um / 30oz |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 7.0mm |
| Maximum dimensions | 580mm x 1080mm, advanced 610mm x 1400mm |
| Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.20mm |