Multilayer PCBs

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8L multilayer – general description: high density PCB; materials: FR-4 Shengyi S-1000-2; solder mask color: blue; surface treatment: ENIG; PTH to copper line spacing: 0.015mm; inner/outer layer line width and spacing: 0.07mm/0.075mm; impedance control tolerance: +/- 7%; hole size tolerance: +/- 0.05mm; BGA pad: 0.25mm

FeatureTechnical Specification
Number of layers 4 – 22 layers standard, 30 layers advanced, 40 layers prototype.
Technology highlightsMultilpe layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
MaterialsHigh performance FR-4, Halogen-free FR-4, Low loss and High frequency materials
Copper weights (finished)18um – 210um, advanced 1050um / 30oz
Minimum track and gap0.075mm / 0.075mm
PCB thickness0.40mm – 7.0mm
Maximum dimensions
580mm x 1080mm, advanced 610mm x 1400mm
Surface finishes available HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill0.20mm