Capabilities

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The information below details some of the key capabilities that we can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering and this shows the very best that we can offer, but here the supply chain or sourcing options is limited and in some cases this means that only one plant is capable of this parameter.

Standard
Advanced
MaterialsRIGID:
FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC
FLEX:
PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan, Hanwha
IMS:
IMS Al based including:
Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.
RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD
FLEX:
PI, LCP including: Dupont
IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi
Minimum dielectric thickness0.005mm for PCB
0.025mm for FPC
≤0.025mm for PCB
0.012mm for FPC
Layer count1 – 38L / 40L QTA64L (pilot runs)
HDI / Buried – blind viaYY
Copper filled BVH (Y/N)YY
Copper filled PTH (Y/N)YY
Copper paste filled PTH (Y/N)YY
Capped via (Y/N)YY
LDI (Y/N)YY
Maximum board size (mm)1050 x 6101400 x 610
Minimum board thickness (mm) 2L0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
Minimum board thickness (mm) ≥4L0.25 for PCB
0.20 for FPC
0.25 for PCB
0.16 for FCP
Maximum board thickness (mm)8.010.0
Minimum track / gap IL (mil)- copper weight dependant0.075mm0.05mm
Minimum track / gap OL (mil)- copper weight dependant0.075mm0.05mm
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG + GF / Isn + GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF / IAG + GF / Isn + GF
Layer to layer registration0.10mm≤ 0.075mm
Minimum hole (mech) (mm/mil)0.20mm0.15mm
Minimum hole (laser) (mm/mil)0.10mm0.06mm
Aspect ratio PTH10:120:1
Aspect ration BVH0.8:11.3:1 (factory + design dependant)
Finish hole tolerance (PTH)± 0.10mm± 0.05mm
Finish hole tolerance (NPTH)± 0.05mm≤ ± 0.05mm
Maximum Cu weight OL6oz (UL approved)
10oz (non-UL approved)
10oz
Maximum Cu weight IL6oz (UL approved)
10oz (non-UL approved)
10oz
Controlled impedance (+/- X%)Others ± 10%± 5%
Rigid-flex (Y/N)YY including semi flex
Flexible (Y/N)YY
IMS (Y/N)Y (Al)Y (both Al and Cu)
Embedded components (Y/N)YY
Soldermask via plugging IPC4761 Type VI (Y/N)YY
Epoxy via plugging IPC4761 Type VI (Y/N)YY
Epoxy via plugging IPC4761 Type VII (Y/N)YY