HDI – High Density Interconnect PCBs



8L HDI – materials: FR-4 Shengyi S-1000-2; finished thickness: 1.60mm +/- 10%; BGA size: 0.25mm; line width and space: 0.10/0.10 mm; surface treatment: ENIG; features: fine pitch, copper filled via technology

FeatureTechnical Specification
Number of layers 4 – 22 layers standard, 30 layers advanced
Technology highlightsMultilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
MaterialsFR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished)18um – 70um
Minimum track and gap0.075mm / 0.075mm
PCB thickness0.40mm – 3.20mm
Maximum dimensions
610mm x 450mm; dependant upon laser drilling machine
Surface finishes availableOSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill0.15mm
Minimum laser drill0.10mm standard, 0.075mm advanced