MPCB – materials: Bergquist/HT-07006 A1:5052; solder mask: Tamura/DSR-2200 TT 31DX; board thickness: 1.85mm +/- 10%; copper thickness: 3oz; surface treatement: LF HASL; description: power products
| Feature | Technical Specification |
|---|---|
| Number of layers | 1 – 4 layers |
| Technology highlights | Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems. |
| Materials | Aluminium & copper plates. FR-4, PTFE, thermal dielectrics. |
| Dielectric thickness | 0.05mm – 0.20mm |
| Thermal conductivity | 3 (W/(m·K)) |
| Profile method | Punching, Liquid cooled routing |
| Copper weights (finished) | 35um – 140um |
| Minimum track and gaps | 0.10mm / 0.10mm |
| Metal core thickness | 0.40mm – 3.20mm |
| Maximum dimensions | 550mm x 700mm |
| Surface finishes available | HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver |
| Minimum mechanical drill | 0,30mm |