| Standard | Advanced | |
|---|---|---|
| Materials | RIGID: FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC FLEX: PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan, Hanwha IMS: IMS Al based including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. | RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD FLEX: PI, LCP including: Dupont IMS: IMS Al & Cu based including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi |
| Minimum dielectric thickness | 0.005mm for PCB 0.025mm for FPC | ≤0.025mm for PCB 0.012mm for FPC |
| Layer count | 1 – 38L / 40L QTA | 64L (pilot runs) |
| HDI / Buried – blind via | Y | Y |
| Copper filled BVH (Y/N) | Y | Y |
| Copper filled PTH (Y/N) | Y | Y |
| Copper paste filled PTH (Y/N) | Y | Y |
| Capped via (Y/N) | Y | Y |
| LDI (Y/N) | Y | Y |
| Maximum board size (mm) | 1050 x 610 | 1400 x 610 |
| Minimum board thickness (mm) 2L | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC |
| Minimum board thickness (mm) ≥4L | 0.25 for PCB 0.20 for FPC | 0.25 for PCB 0.16 for FCP |
| Maximum board thickness (mm) | 8.0 | 10.0 |
| Minimum track / gap IL (mil)- copper weight dependant | 0.075mm | 0.05mm |
| Minimum track / gap OL (mil)- copper weight dependant | 0.075mm | 0.05mm |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG + GF / Isn + GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF / IAG + GF / Isn + GF |
| Layer to layer registration | 0.10mm | ≤ 0.075mm |
| Minimum hole (mech) (mm/mil) | 0.20mm | 0.15mm |
| Minimum hole (laser) (mm/mil) | 0.10mm | 0.06mm |
| Aspect ratio PTH | 10:1 | 20:1 |
| Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependant) |
| Finish hole tolerance (PTH) | ± 0.10mm | ± 0.05mm |
| Finish hole tolerance (NPTH) | ± 0.05mm | ≤ ± 0.05mm |
| Maximum Cu weight OL | 6oz (UL approved) 10oz (non-UL approved) | 10oz |
| Maximum Cu weight IL | 6oz (UL approved) 10oz (non-UL approved) | 10oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex |
| Flexible (Y/N) | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y |